Hsiang-Chen Hsu, : rechercher sur Z-Library

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[IEEE 2018 International Conference on Electronics Packaging and iMAPS All Asia Conference (ICEP-IAAC) - Mie, Japan (2018.4.17-2018.4.21)] 2018 International Conference on Electronics Packaging and iMAPS All Asia Conference (ICEP-IAAC) - Rapid laser drilling on thick ceramic substrates for SiP applications

Wu, Shih-jeh, Hsu, Hsiang-Chen, Lin, Wen-Fei, Houng, Boen, Chang, Yeh

Année:

2018

Langue:

english

Fichier:

PDF, 422 KB

english, 2018

Characteristic of copper wire and transient analysis on wirebonding process

Hsiang-Chen Hsu, Wei-Yao Chang, Chang-Lin Yeh, Yi-Shao Lai

Journal:

Microelectronics Reliability

Année:

2011

Langue:

english

Fichier:

PDF, 1.52 MB

english, 2011

Further characterization of Pd-coated copper wire on wirebonding process: from a nanoscale perspective

Hsiang-Chen Hsu, Li-Ming Chu, Wei-Yao Chang…

Journal:

Journal of Materials Science: Materials in Electronics

Année:

2013

Langue:

english

Fichier:

PDF, 751 KB

english, 2013

[IEEE 2018 International Conference on Electronics Packaging and iMAPS All Asia Conference (ICEP-IAAC) - Mie, Japan (2018.4.17-2018.4.21)] 2018 International Conference on Electronics Packaging and iMAPS All Asia Conference (ICEP-IAAC) - Laser micro-machining of LPM compound material for panel and IC packaging

Lin, Wen-Fei, Wu, Shih-jeh, Hsu, Hsiang-Chen, Houng, Boen, Chen, Min-Shuo

Année:

2018

Langue:

english

Fichier:

PDF, 639 KB

english, 2018

Compact and vertically-aligned ZnO nanorod thin films by the low-temperature solution method

Chu-Chi Ting, Chang-Hung Li, Chih-You Kuo, Chia-Chen Hsu, Hsiang-Chen Wang, Ming-Hsun Yang

Journal:

Thin Solid Films

Année:

2010

Langue:

english

Fichier:

PDF, 511 KB

english, 2010

[IEEE 2006 7th International Conference on Electronic Packaging Technology - Shanghai, China (2006.08.26-2006.08.29)] 2006 7th International Conference on Electronic Packaging Technology - Parametric Study and Optimal Design in Wire Bonding Process for Mini Stack-Die Package

Hsu, Hsiang-Chen, Yu, Shen-Wen, Hsu, Yu-Teng, Chang, Wei-Yaw, Lin, Ming-Jer, Lin, Ruei-Ming, Chin, Pei-Chieh, Ho, Hung-Chun, Lu, Ming-Cheng, Lee, Cheng-Tung, Chen, Chin-Liang, Liao, Chien-Hung, Huang,

Année:

2006

Langue:

english

Fichier:

PDF, 5.44 MB

english, 2006

[IEEE 2008 10th Electronics Packaging Technology Conference (EPTC) - Singapore, Singapore (2008.12.9-2008.12.12)] 2008 10th Electronics Packaging Technology Conference - Characteristic of Heat Affected Zone for Ultra Thin Gold Wire/Copper Wire and Advanced Finite Element Wirebonding Model

Chang, Wei-Yao, Hsu, Hsiang-Chen, Fu, Shen-Li, Yeh, Chang-Lin, Lai, Yi-Shao

Année:

2008

Langue:

english

Fichier:

PDF, 4.01 MB

english, 2008

[IEEE High Density Packaging (ICEPT-HDP) - Beijing, China (2009.08.10-2009.08.13)] 2009 International Conference on Electronic Packaging Technology & High Density Packaging - Electromigration analysis and electro-thermo-mechanical design for semiconductor package

Hsu, Hsiang-Chen, Ju, Shen-Wen, Lu, Jie-Rong, Chang, Hong-Shen, Wu, Hong-Hau

Année:

2009

Langue:

english

Fichier:

PDF, 986 KB

english, 2009

[IEEE Circuits Technology Conference (IMPACT) - Taipei, Taiwan (2008.10.22-2008.10.24)] 2008 3rd International Microsystems, Packaging, Assembly & Circuits Technology Conference - An Investigation on Heat Affected Zone for Au Wire/Cu Wire and Advanced Finite Element Wirebonding Model

Chang, Wei-Yao, Hsu, Hsiang-Chen, Fu, Shen-Li, Lai, Yi-Shao, Yeh, Chang-Lin

Année:

2008

Langue:

english

Fichier:

PDF, 4.12 MB

english, 2008

[IEEE 2007 International Microsystems, Packaging, Assembly and Circuits Technology - Taipei, Taiwan (2007.10.1-2007.10.3)] 2007 International Microsystems, Packaging, Assembly and Circuits Technology - Characteristic of heat affected zone in thin gold wire and dynamic transient analysis of wire bonding for microstructure of Cu/Low-K wafer

Pei-Chieh Chin,, Chin-Yuan Hu,, Hsiang-Chen Hsu,, Shen-Li Fu,, Chang-Lin Yeh,, Yi-Shao Lai,

Année:

2007

Langue:

english

Fichier:

PDF, 896 KB

english, 2007

[IEEE 2007 International Conference on Electronic Materials and Packaging (EMAP 2007) - Daejeon, Korea (2007.11.19-2007.11.22)] 2007 International Conference on Electronic Materials and Packaging - Dynamic finite element analysis on underlay microstructure of Cu/low-K wafer during bonding process

Hsiang-Chen Hsu,, Wei-Yaw Chang,, Shen-Li Fu,, Chang-Lin Yeh,, Yi-Shao Lai,

Année:

2007

Langue:

english

Fichier:

PDF, 765 KB

english, 2007

Design on MEMS-based 3D biochip for drug-released dispenser

Hsu, Hsiang-Chen, Chu, Li-Ming, Liu, Baojun, Lai, Chien-Yuan

Journal:

Microsystem Technologies

Année:

2017

Langue:

english

Fichier:

PDF, 1.97 MB

english, 2017

[IEEE 2016 International Conference on Electronics Packaging (ICEP) - Hokkaido, Japan (2016.4.20-2016.4.22)] 2016 International Conference on Electronics Packaging (ICEP) - Through Mold Via (TMV) by gas-aided laser

Hsu, Hsiang-Chen, Wu, Shih-Jeh, Lin, Wen-Fei, Hsi, Chi-Shiung, Pao, Hsing-Yi, Wang, Pin-Chieh

Année:

2016

Langue:

english

Fichier:

PDF, 1.29 MB

english, 2016

Squeeze film characteristics of circular contacts at impact and rebound motion with micropolar lubricants

Chu, Li-Ming, Lin, Jaw-Ren, Chang, Yuh-Ping, Hsu, Hsiang-Chen

Journal:

Microsystem Technologies

Année:

2017

Langue:

english

Fichier:

PDF, 1.25 MB

english, 2017

[IEEE 2018 International Conference on System Science and Engineering (ICSSE) - New Taipei City, Taiwan (2018.6.28-2018.6.30)] 2018 International Conference on System Science and Engineering (ICSSE) - Capacitor Detection in PCB Using YOLO Algorithm

Lin, Yih-Lon, Chiang, Yu-Min, Hsu, Hsiang-Chen

Année:

2018

Langue:

english

Fichier:

PDF, 506 KB

english, 2018

Reliability Design and Optimization Process on through Mold via using Ultrafast Laser

Hsu, Hsiang-Chen, Wu, Shih-Jeh, Lin, Wen-Fei, Houng, Boen

Journal:

Polymers and Polymer Composites

Année:

2018

Langue:

english

Fichier:

PDF, 1.54 MB

english, 2018

[IEEE 2019 International Conference on Electronics Packaging (ICEP) - Niigata, Japan (2019.4.17-2019.4.20)] 2019 International Conference on Electronics Packaging (ICEP) - An Investigation of Compound Machining of Ceramic-LPM Package by Ultrafast Laser

Wu, Shih-jeh, Hsu, Hsiang-Chen, Lin, Wen-Fei, Chang, Yeh, Yen, Ching-Pin

Année:

2019

Langue:

english

Fichier:

PDF, 2.17 MB

english, 2019

Depth dependence of optical property beyond the critical thickness of an InGaN film

Chih-Chung Teng, Hsiang-Chen Wang, Tsung-Yi Tang, Yen-Cheng Lu, Yung-Chen Cheng, C.C. Yang, Kung-Jen Ma, Wei-Ming Wang, Chi-Wei Hsu, L.C. Chen

Journal:

Journal of Crystal Growth

Année:

2006

Langue:

english

Fichier:

PDF, 389 KB

english, 2006

Magneto-elastohydrodynamic lubrication of circular contacts at impact loading

Li-Ming Chu, Wang-Long Li, Hsiang-Chen Hsu, Yuh-Ping Chang

Journal:

Tribology International

Année:

2009

Langue:

english

Fichier:

PDF, 429 KB

english, 2009

Inverse approach for calculating temperature in EHL of line contacts

Li-Ming Chu, Hsiang-Chen Hsu, Jaw-Ren Lin, Yuh-Ping Chang

Journal:

Tribology International

Année:

2009

Langue:

english

Fichier:

PDF, 703 KB

english, 2009

Elastohydrodynamic Lubrication of Circular Contacts at Impact Loading with Generalized Newtonian Lubricants

Hsiao-Ming Chu, Jiann-Lin Chen, Hsiang-Chen Hsu, Wang-Long Li

Journal:

Tribology Letters

Année:

2008

Langue:

english

Fichier:

PDF, 629 KB

english, 2008

Chaotic responses on gear pair system equipped with journal bearings under turbulent flow

Cai-Wan Chang-Jian, Hsiang-Chen Hsu

Journal:

Applied Mathematical Modelling

Année:

2012

Langue:

english

Fichier:

PDF, 1.69 MB

english, 2012

Effect of oxide additives on the low-temperature sintering of dielectrics (Zn,Mg)TiO3

Ming-Liang Hsieh, Lih-Shan Chen, Hsiang-Chen Hsu, Shuming Wang, Mau-Phon Houng, Shen-Li Fu

Journal:

Materials Research Bulletin

Année:

2008

Langue:

english

Fichier:

PDF, 781 KB

english, 2008

Numerical simulation of high power LED heat-dissipating system

Wu, Shih-Jeh, Hsu, Hsiang-Chen, Fu, Shen-Li, Yeh, Jiam-Nan

Journal:

Electronic Materials Letters

Année:

2014

Langue:

english

Fichier:

PDF, 723 KB

english, 2014

[IEEE 2005 7th Electronic Packaging Technology Conference - Singapore (07-09 Dec. 2005)] 2005 7th Electronic Packaging Technology Conference - Reliability and Thermal Structure Design for CMOS Image Sensor

Hsiang-Chen Hsu,, Hui-Yu Lee,, Yu-Chia Hsu,, Shen-Li Fu,, Chung-Chi Yang,, Kuan-Chieh Huang,

Année:

2005

Langue:

english

Fichier:

PDF, 2.89 MB

english, 2005

[IEEE 2012 14th International Conference on Electronic Materials and Packaging (EMAP) - Lantau Island, Hong Kong (2012.12.13-2012.12.16)] 2012 14th International Conference on Electronic Materials and Packaging (EMAP) - An investigation on secondary EFO copper wire - from a nanoscale perspective view

Hsu, Hsiang-Chen, Chien, Jih-Hsin, Wang, Chen-Yi, Liu, Cheng-Che, Fu, Shen-Li, Bair, Miin Shyan

Année:

2012

Langue:

english

Fichier:

PDF, 691 KB

english, 2012

[IEEE 2011 6th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) - Taipei, Taiwan (2011.10.19-2011.10.21)] 2011 6th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) - A study on Nano-mechanical properties and nano-tribology for ultra-thin Pt-coated 4N copper wire

Hsu, Hsiang-Chen, Chien, Jih-Hsin, Fu, Shen-Li

Année:

2011

Langue:

english

Fichier:

PDF, 767 KB

english, 2011

[IEEE 2011 6th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) - Taipei, Taiwan (2011.10.19-2011.10.21)] 2011 6th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) - An investigation of temperature influence on the SAC305 soldering on Cu-Ni-Au substrate

Hsu, Hsiang-Chen, Wan, Yu-Ming, Haung, Chi-Hau, Fu, Shen-Li

Année:

2011

Langue:

english

Fichier:

PDF, 694 KB

english, 2011

[IEEE 2006 7th International Conference on Electronic Packaging Technology - Shanghai, China (2006.08.26-2006.08.29)] 2006 7th International Conference on Electronic Packaging Technology - A Novel Submodeling Scheme on Thermal Cycle Test for CMOS Image Sensor

Hsu, Hsiang-Chen, Lee, Hui-Yu, Hsu, Yu-Chia, Hu, Chin-Yuan, Lin, Ming-Jer, Chin, Pei-Chieh, Fu, Shen-Li, Chung, Mark C. L., Tseng, Ching-Chung

Année:

2006

Langue:

english

Fichier:

PDF, 5.64 MB

english, 2006

[IEEE High Density Packaging (ICEPT-HDP) - Beijing, China (2009.08.10-2009.08.13)] 2009 International Conference on Electronic Packaging Technology & High Density Packaging - Advanced moisture diffusion model and hygro-thermo-mechanical design for flip chip BGA package

Tsai, Ming-Han, Hsu, Feng-Jui, Weng, Meng-Chieh, Hsu, Hsiang-Chen

Année:

2009

Langue:

english

Fichier:

PDF, 914 KB

english, 2009

[IEEE 2006 International Conference on Electronic Materials and Packaging - Kowloon, China (2006.12.11-2006.12.14)] 2006 International Conference on Electronic Materials and Packaging - Finite Element Analysis of Dynamic Drop Impact of Board-level Stacked-Die Packages Using Submodeling Technique

Hsu, Hsiang-Chen, Hsu, Yu-Chia, Lee, Hui-Yu, Yeh, Chang-Lin, Lai, Yi-Shao, Fu, Shen-Li

Année:

2006

Langue:

english

Fichier:

PDF, 2.02 MB

english, 2006

[IEEE High Density Packaging (ICEPT-HDP) - Shanghai, China (2008.07.28-2008.07.31)] 2008 International Conference on Electronic Packaging Technology & High Density Packaging - Low temperature sinterable (Zn,Mg)TiO3 microwave dielectrics

Lih-Shan Chen,, Ming-Liang Hsieh,, Hsiang-Chen Hsu,, Shen-Li Fu,

Année:

2008

Langue:

english

Fichier:

PDF, 1.50 MB

english, 2008

[IEEE 2009 4th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) - Taipei, Taiwan (2009.10.21-2009.10.23)] 2009 4th International Microsystems, Packaging, Assembly and Circuits Technology Conference - Electro-thermo-mechanical design and electromigration analysis for Package-On-Package (POP)

Hsiang-Chen Hsu,, Shen-Wen Ju,, Jie-Rong Lu,, Shen-Li Fu,

Année:

2009

Langue:

english

Fichier:

PDF, 1.78 MB

english, 2009

[IEEE 2010 5th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) - Taipei, Taiwan (2010.10.20-2010.10.22)] 2010 5th International Microsystems Packaging Assembly and Circuits Technology Conference - Thermal aging effect on copper wire and micro interfacial frictional behavior along Cu FAB and Al pad

Hsu, Hsiang-Chen, Fu, Chih-Chiang, Chang, Hong-Shen, Fu, Shen-Li, Kung, Huang-Kuang

Année:

2010

Langue:

english

Fichier:

PDF, 218 KB

english, 2010

[IEEE 4th International Symposium on Electronic Materials and Packaging - Kaohsiung, Taiwan (4-6 Dec. 2002)] Proceedings of the 4th International Symposium on Electronic Materials and Packaging, 2002. - Thermal design and reliability of convenable MultiChip Module package on HDIIVH substrates

Hsiang-Chen Hsu,, Lih-Shan Chen,, Lee-Wei Chu,

Année:

2002

Langue:

english

Fichier:

PDF, 269 KB

english, 2002

[IEEE 2009 4th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) - Taipei, Taiwan (2009.10.21-2009.10.23)] 2009 4th International Microsystems, Packaging, Assembly and Circuits Technology Conference - The experimental measurement of wire sag of long wire bonds for 3-dimensional and multi-chip module packaging

Kung, Huang-Kuang, Hong-Shong Chen,, Jwo-Ming Jou,, Hsiang-Chen Hsu,

Année:

2009

Langue:

english

Fichier:

PDF, 1.45 MB

english, 2009

[IEEE 2012 7th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) - Taipei, Taiwan (2012.10.24-2012.10.26)] 2012 7th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) - Nanoscale bondability study on copper-aluminum intermetallic compound using molecular dynamics simulation

Hsiang-Chen Hsu,, Jih-Hsin Chien,, Li-Ming Chu,, Shin-Pon Ju,, Yu-Ting Feng,, Shen-Li Fu,

Année:

2012

Langue:

english

Fichier:

PDF, 798 KB

english, 2012

[IEEE 2006 8th Electronics Packaging Technology Conference - Singapore (2006.12.6-2006.12.8)] 2006 8th Electronics Packaging Technology Conference - Application of submodeling technique to transient drop impact analysis of board-level stacked die packages

Hsu, Hsiang-chen, Hsu, Yu-chia, Lee, Hui-yu, Yeh, Chang-lin, Lai, Yi-shao

Année:

2006

Langue:

english

Fichier:

PDF, 348 KB

english, 2006

[IEEE 2008 3rd IEEE International Conference on Nano/Micro Engineered and Molecular Systems - Sanya, China (2008.01.6-2008.01.9)] 2008 3rd IEEE International Conference on Nano/Micro Engineered and Molecular Systems - Vibrations and mechanically-induced currents in nanopillars transistor

Yue-Min Wan,, Shiao-Yu Chen,, Hein-Tien Lin,, Chih-An Chen,, Hsiang-Chen Hsu,

Année:

2008

Langue:

english

Fichier:

PDF, 317 KB

english, 2008

[IEEE 2008 International Conference on Electronic Materials and Packaging (EMAP) - Taipei, Taiwan (2008.10.22-2008.10.24)] 2008 International Conference on Electronic Materials and Packaging - Fabrication and characterization of passive devices on flexible substrates

Pei-Ju Lin,, Hung-Ming Chang,, Ching-Chien Yuan,, Yu-Jung Huang,, Lih-Shan Chen,, Hsiang-Chen Hsu,, Shen-Li Fu,

Année:

2008

Langue:

english

Fichier:

PDF, 4.46 MB

english, 2008

[IEEE 2010 5th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) - Taipei, Taiwan (2010.10.20-2010.10.22)] 2010 5th International Microsystems Packaging Assembly and Circuits Technology Conference - The effect of cross-section geometry of bonding wire on wire sweep for semiconductor packages

Kung, Huang-Kuang, Huang, Bo-Wun, Hsu, Hsiang-Chen

Année:

2010

Langue:

english

Fichier:

PDF, 131 KB

english, 2010

[IEEE 2013 8th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) - Taipei, Taiwan (2013.10.22-2013.10.25)] 2013 8th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) - An investigation on nanoscale bondability between Cu-Al intermetallic compound

Hsu, Hsiang-Chen, Chien, Jih-Hsin, Wang, Chen-Yi, Chu, Li-Ming, Ju, Shin-Pon, Fu, Shen-Li, Bai, Miin Shyan

Année:

2013

Langue:

english

Fichier:

PDF, 933 KB

english, 2013

Simulation of Internal Fixation Surgery for Calcaneal Collapse with 3D fullsized Computer-Aided Technology

Sun, Shuh-Ping, Hsu, Hsiang-Chen, Chou, Yi-Jiun

Journal:

Computer-Aided Design and Applications

Année:

2012

Langue:

english

Fichier:

PDF, 883 KB

english, 2012

[IEEE 2013 8th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) - Taipei, Taiwan (2013.10.22-2013.10.25)] 2013 8th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) - Thermal design for high power arrayed LED heat-dissipating system

Hsu, Hsiang-Chen, Wu, Shih-Jeh, Li, Jyun-Yi, Su, Jing-Wen, Huang, Jian-Siang, Fu, Shen-Li

Année:

2013

Langue:

english

Fichier:

PDF, 1.24 MB

english, 2013

[IEEE High Density Packaging (ICEPT-HDP) - Xi'an, China (2010.08.16-2010.08.19)] 2010 11th International Conference on Electronic Packaging Technology & High Density Packaging - Reliability analysis on electromigration and electro-thermo-mechanical for Sn4.0Ag0.5Cu solder ball

Hsu, Hsiang-Chen, Lu, Jie-Rong, Yue-Min Wan,, Fu, Shen-Li

Année:

2010

Langue:

english

Fichier:

PDF, 968 KB

english, 2010

[IEEE 2013 8th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) - Taipei, Taiwan (2013.10.22-2013.10.25)] 2013 8th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) - Electrochemical migration failure on FR-4 PCB by hygro-thermo-vapor pressure coupled analysis

Hsu, Hsiang-Chen, Wu, Shih-Jeh, Hsu, Feng-Jui, Weng, Meng-Chieh, Fu, Shen-Li

Année:

2013

Langue:

english

Fichier:

PDF, 665 KB

english, 2013

[IEEE Circuits Technology Conference (IMPACT) - Taipei, Taiwan (2008.10.22-2008.10.24)] 2008 3rd International Microsystems, Packaging, Assembly & Circuits Technology Conference - Hygroscopic Swelling Effect on Polymeric Materials and Thermo-hygro-mechanical Design on Finger Printer Package

Hsu, Hsiang-Chen, Hsu, Yu-Teng, Hsich, Wen-Lo, Weng, Meng-Chieh, ZhangJian, Shao-Tang, Hsu, Feng-Jui, Chen, Yi-Feng, Fu, Shen-Li

Année:

2008

Langue:

english

Fichier:

PDF, 4.32 MB

english, 2008

[IEEE 2010 34th International Electronics Manufacturing Technology Conference (IEMT) - Melaka, Malaysia (2010.11.30-2010.12.2)] 2010 34th IEEE/CPMT International Electronic Manufacturing Technology Symposium (IEMT) - Advanced finite element model on Copper wire ball bonding

Hsu, Hsiang-Chen, Hong-Shen Chang,, Shu-Chi Tsao,, Fu, Shen-Li

Année:

2010

Fichier:

PDF, 987 KB

2010

Novel design and fabrication of a geometrical obstacle-embedded micromixer with notched wall

Wu, Shih-Jeh, Hsu, Hsiang-Chen, Feng, Wen-Jui

Journal:

Japanese Journal of Applied Physics

Année:

2014

Langue:

english

Fichier:

PDF, 1.39 MB

english, 2014

ECS Transactions [ECS China Semiconductor Technology International Conference 2012 (CSTIC 2012) - Shanghai, China (March 18 - March 19, 2012)] - An Investigation on Mechanical Behavior on Pt-Coated Copper Wire from a Nanoscale Perspective

Hsu, Hsiang-Chen, Lee, Guowei, Feng, Wen-Ruei, Kuo, Chun-Hsien

Année:

2012

Langue:

english

Fichier:

PDF, 516 KB

english, 2012